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How to optimize and control the wire bonding process: part 1
- Source :
- Solid State Technology. November, 1990, Vol. 33 Issue 11, p119, 5 p.
- Publication Year :
- 1990
-
Abstract
- Wire bonding is an extremely high yield, high speed, automated manufacturing process. Modern wire bonders are capable of bonding 8 to 10 wires/sec and typical monthly throughput can exceed 500,000 […]
- Subjects :
- Solid state electronics -- Production management
Subjects
Details
- Language :
- English
- ISSN :
- 0038111X
- Volume :
- 33
- Issue :
- 11
- Database :
- Gale General OneFile
- Journal :
- Solid State Technology
- Publication Type :
- Periodical
- Accession number :
- edsgcl.9157108