Lithium doped polyethylene-glycol-based thermal interface pastes for high thermal contact conductance

Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (~18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation of the salt to release [Li.sup.+] ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone. [DOI: 10.1115/1.1477191] Keywords: Polymer, Polyethylene Glycol Lithium, Boron Nitride, Thermal Interface, Thermal Contact, Thermal Conductance, Composite