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Test chip irons out wrinkles in 0.13-µm process. (News on Technology, R&D, Products, and Business)
- Source :
- Electronic Design. April 1, 2002, Vol. 50 Issue 7, p27, 1 p.
- Publication Year :
- 2002
-
Abstract
- A test chip for researching signal integrity effects in a 0.13-µm process has been taped out. The ATG-SI, a collaboration between UMC, Sunnyvale, Calif., and Synopsys Inc., Mountain View, Calif., […]
- Subjects :
- Research and development
Embedded system
System on a chip
Electronic design automation
UMC Electronics Co. -- Research -- Innovations
Synopsys Inc. -- Research -- Innovations
High technology industry -- Research
Embedded systems -- Innovations
Industrial research -- United States
Electronic design automation -- Innovations -- Research
Research institutes -- Research
Subjects
Details
- Language :
- English
- ISSN :
- 00134872
- Volume :
- 50
- Issue :
- 7
- Database :
- Gale General OneFile
- Journal :
- Electronic Design
- Publication Type :
- Periodical
- Accession number :
- edsgcl.84548287