Researchers Submit Patent Application, 'Double-Sided Polishing Of Semiconductor Wafers With Dynamic Control', for Approval (USPTO 20250001546)

Source :: Electronics Newsweekly. January 21, 2025, 7064
Publication Year :: 2025
Abstract: 2025 JAN 21 (VerticalNews) -- By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Chen, Liang [...]

Subjects :: Semiconductor wafers -- Intellectual property
Integrated circuits -- Intellectual property
Semiconductor chips -- Intellectual property
Standard IC
Electronics

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