Researchers Submit Patent Application, 'Integrated Thermal Bridges On Wirebond Assembled Integrated Circuits For Heat Spreading', for Approval (USPTO 20240421092)

Source :: Electronics Newsweekly. January 7, 2025, 5386
Publication Year :: 2025
Abstract: 2025 JAN 7 (VerticalNews) -- By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor Mangold, Tobias [...]

Subjects :: Integrated circuits -- Intellectual property
Semiconductor chips -- Intellectual property
Electronics industry -- Intellectual property
Standard IC
Electronics industry
Electronics

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