Researchers Submit Patent Application, 'Integrated Circuit Device Including Multi-Layer Interconnect Pillar', for Approval (USPTO 20240413112)

Source :: Politics & Government Week. January 2, 2025, p9049.
Publication Year :: 2025
Abstract: 2025 JAN 2 (VerticalNews) -- By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors [...]

Subjects :: Standard IC
Semiconductor device
Integrated circuits -- Intellectual property
Circuit components -- Intellectual property
Semiconductor chips -- Intellectual property

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