Patent Issued for 3D semiconductor device and structure with bonding and memory cells preliminary class (USPTO 12144190)

Source :: Electronics Newsweekly. December 3, 2024, 3181
Publication Year :: 2024
Abstract: 2024 DEC 3 (VerticalNews) -- By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Cronquist, Brian (Klamath [...]

Subjects :: Memory (Computers) -- Intellectual property -- Reports
Integrated circuits -- Intellectual property -- Reports
Semiconductor chips -- Intellectual property -- Reports
Standard IC
Semiconductor memory
Electronics

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