Patent Issued for Three-dimensional chip packaging structure and method thereof (USPTO 11735564)

Source :: Electronics Newsweekly. September 12, 2023, 2533
Publication Year :: 2023
Abstract: 2023 SEP 12 (VerticalNews) -- By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Chen, Yenheng (Jiangyin, [...]

Subjects :: Semiconductor industry -- Intellectual property
Integrated circuits -- Intellectual property -- Methods -- Reports
Semiconductor chips -- Intellectual property -- Methods -- Reports
Integrated circuit fabrication -- Methods -- Reports
Semiconductor industry
Standard IC
Integrated circuit fabrication
Electronics

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