Back to Search
Start Over
Electromigration of eutectic SnPb solder interconnects for flip chip technology
- Source :
- Journal of Applied Physics. March 15, 2001, Vol. 89 Issue 6, p3189, 6 p.
- Publication Year :
- 2001
-
Abstract
- Eutectic SnPb solder interconnect electromigration between a Si chip and a FR4 substrate was examined.
- Subjects :
- Electrodiffusion -- Observations
Solder and soldering -- Research
Physics
Subjects
Details
- ISSN :
- 00218979
- Volume :
- 89
- Issue :
- 6
- Database :
- Gale General OneFile
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.74871359