GBT's 3D, Multiplanar IC Continuation Patent Application Received an Issue Notification, expected to be Granted on August 9, 2022

Source :: GlobeNewswire. August 9, 2022
Publication Year :: 2022
Abstract: SAN DIEGO, Aug 09, 2022 (GLOBE NEWSWIRE via COMTEX) -- This second 3D, MP microchip Application Seeks to Further Strengthen GBT's Multi-Dimensional Integrated Circuits Design and Manufacturing Concept GBT Technologies [...]

Subjects :: Circuit design
Integrated circuits -- Intellectual property
Semiconductor chips -- Intellectual property
Standard IC
Integrated circuit design
Circuit designer
Banking, finance and accounting industries
Business

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