New Findings on Applied Surface Science Described by Investigators at Xiamen University (Dislocation Nucleation Triggered By Thermal Stress During Ge/si Wafer Bonding Process At Low Annealing Temperature)

Source :: Science Letter. January 14, 2022, 865
Publication Year :: 2022
Abstract: 2022 JAN 14 (NewsRx) -- By a News Reporter-Staff News Editor at Science Letter -- New research on Science - Applied Surface Science is the subject of a report. According [...]

Subjects :: Strains and stresses -- Analysis
Nucleation -- Analysis
Stress relaxation (Materials) -- Analysis
Annealing -- Analysis
Stress relieving (Materials) -- Analysis
Germanium -- Properties
Silicon -- Properties
Electronic packaging -- Methods -- Analysis
Health
Science and technology

Tools