'Integrated circuit substrate having a recess for receiving a solder fillet' in Patent Application Approval Process (USPTO 20210195734)

Source :: Health & Medicine Week. July 16, 2021, 7783
Publication Year :: 2021
Abstract: 2021 JUL 16 (NewsRx) -- By a News Reporter-Staff News Editor at Health & Medicine Week -- A patent application by the inventors Ang, Poh Cheng (Bayan Lepas, MY); Hwang, [...]

Subjects :: Integrated circuits -- Intellectual property
Circuit components -- Intellectual property
Semiconductor chips -- Intellectual property
Standard IC
Semiconductor device
Health

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