Detailed experimental and theoretical investigation of the thermomechanical properties of epoxy composites containing paraffin microcapsules for thermal management

Microencapsulated phase change materials (PCMs) are being increasingly employed as functional fillers in polymer matrices for thermal management. Therefore, the effect of PCM microcapsules on the rheological, microstructural, thermal and mechanical properties of the host polymer matrices must be understood. This work concerned the preparation of epoxy polymers filled with PCM microcapsules (MC) in various concentrations and their subsequent characterization. The MC phase increases the viscosity of epoxy before curing, thereby reducing castability and hindering elimination of air bubbles. The latter was reflected in an increase in porosity for highly filled compositions, as elucidated by density measurements and microscopic investigation. SEM micrographs showed that the adhesion between the capsule shell and the epoxy matrix was not optimal. The interfacial weakness and the intrinsic low Stiffiiess and strength of MC caused a reduction in mechanical properties, as evidenced by the Nicolais-Narkis and Pukanszky models. On the other hand, at zero or low deformation levels, the interface presents no gaps and is able to transfer load and heat, as demonstrated by the data of elastic modulus, modeled with the Halpin-Tsai and Lewis-Nielsen models, and those of thermal conductivity, in excellent agreement with the Pal model. KEYWORDS interfaces, mechanical properties, microencapsulation, thermal properties, thermosets
1 | INTRODUCTION Organic phase change materials (PCMs) are the most commonly employed materials for thermal energy storage (TES), particularly at 0 to 100[degrees]C. [1] PCMs represent an innovative, renewable [...]