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Wafer-Level Interconnect Demonstrated

Authors :
Brown, C.
Source :
Electronic Engineering Times. April 15, 1985, Issue n325, pp6
Publication Year :
1985

Subjects

Subjects :
Integrated Circuits
Hybrid Circuits
Technology
Chip Packaging
VLSI
Packaging Density
Prototype
Mosaic Systems Inc. -- Research

Details

ISSN :
01921541
Issue :
n325
Database :
Gale General OneFile
Journal :
Electronic Engineering Times
Publication Type :
Periodical
Accession number :
edsgcl.616759

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