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Solder Paste Migration: Are you vacuuming the right way?
- Source :
- Printed Circuit Design & Fab Circuits Assembly. January, 2020, Vol. 37 Issue 1, p45, 1 p.
- Publication Year :
- 2020
-
Abstract
- THIS MONTH WE see a solder paste print deposit with what appears to be migration of paste particles away from the main pad. If this is just a one-off, a [...]
Details
- Language :
- English
- ISSN :
- 19395442
- Volume :
- 37
- Issue :
- 1
- Database :
- Gale General OneFile
- Journal :
- Printed Circuit Design & Fab Circuits Assembly
- Publication Type :
- Periodical
- Accession number :
- edsgcl.613133605