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Cleaning Before High-Temperature Aging: Flux becomes increasingly tenacious the longer it sits on the board
- Source :
- Printed Circuit Design & Fab Circuits Assembly. October, 2019, Vol. 36 Issue 10, p43, 1 p.
- Publication Year :
- 2019
-
Abstract
- THIS MONTH OUR topic is not so much a defect as something to consider when running environmental tests before any destructive analysis on solder joints. The through-hole joints shown in [...]
Details
- Language :
- English
- ISSN :
- 19395442
- Volume :
- 36
- Issue :
- 10
- Database :
- Gale General OneFile
- Journal :
- Printed Circuit Design & Fab Circuits Assembly
- Publication Type :
- Periodical
- Accession number :
- edsgcl.604896339