Back to Search Start Over

Integrated single and two-phase micro heat sinks under IGBT chips

Authors :
Gillot, Charlotte
Meysenc, Luc
Schaeffer, Christian
Bricard, Alain
Source :
IEEE Transactions on Components and Packaging Technologies. Sept, 1999, Vol. 22 Issue 3, p384, 6 p.
Publication Year :
1999

Abstract

The authors discuss the use of micro heat exchangers to cool insulated gate bipolar transistor (IGBT) power components. Topics include the design and testing of heat exchangers, and how placing a heat exchanger under an IGBT chip can prevent power dissipation.

Subjects

Subjects :
Heat exchangers -- Usage
Bipolar transistors -- Energy use
Heat sinks (Electronics) -- Research
Semiconductors -- Heating, cooling and ventilation
Business
Electronics and electrical industries
Engineering and manufacturing industries

Details

ISSN :
15213331
Volume :
22
Issue :
3
Database :
Gale General OneFile
Journal :
IEEE Transactions on Components and Packaging Technologies
Publication Type :
Periodical
Accession number :
edsgcl.59985197

Tools

Authors Abstract Subjects Details