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Solder Pad Coverage with NiAu and OSP Finishes: Tricks to eliminate exposed copper
- Source :
- Printed Circuit Design & Fab Circuits Assembly. May, 2019, Vol. 36 Issue 5, p44, 1 p.
- Publication Year :
- 2019
-
Abstract
- THIS MONTH WE look at solder pad coverage. Some quality engineers still want to see solder coverage, regardless of the PCB surface finish. If they see the original surface coating, [...]
Details
- Language :
- English
- ISSN :
- 19395442
- Volume :
- 36
- Issue :
- 5
- Database :
- Gale General OneFile
- Journal :
- Printed Circuit Design & Fab Circuits Assembly
- Publication Type :
- Periodical
- Accession number :
- edsgcl.588341699