Back to Search Start Over

Backplane Connectors Offer High-Density Packaging

Source :
Electronic Engineering Times. Sept 17, 1984, Issue n297, pp44
Publication Year :
1984

Subjects

Subjects :
Connector
Technology
New Product
LSI
VLSI
Gate Arrays
Packaging Density
Chip Packaging
Boards/Cards
High Density Plus

Details

ISSN :
01921541
Issue :
n297
Database :
Gale General OneFile
Journal :
Electronic Engineering Times
Publication Type :
Periodical
Accession number :
edsgcl.576753

Tools

Authors Abstract Subjects Details