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Firms Push Stacked CSP
- Source :
- Electronic News (1991). July 12, 1999, Vol. 45 Issue 28, p44
- Publication Year :
- 1999
-
Abstract
- Tokyo-Stacked chip-scale package standardization efforts accelerated last week. Hitachi Ltd., Intel Corp., Mitsubishi Electric Corp. and Sharp Corp. agreed to standardize specifications for stacked chip scale packages (S-CSP), a multiple-memory […]
Details
- Language :
- English
- ISSN :
- 10616624
- Volume :
- 45
- Issue :
- 28
- Database :
- Gale General OneFile
- Journal :
- Electronic News (1991)
- Publication Type :
- Periodical
- Accession number :
- edsgcl.55190539