Cite
Effect of thin V insertion layer into Ta film on the performance of Ta diffusion barrier in Cu metallization
MLA
Kwak, Joon Seop, et al. “Effect of Thin V Insertion Layer into Ta Film on the Performance of Ta Diffusion Barrier in Cu Metallization.” Journal of Applied Physics, vol. 85, no. 9, May 1999, p. 6898. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.54712308&authtype=sso&custid=ns315887.
APA
Kwak, J. S., Baik, H. K., Kim, J.-H., Lee, S.-M., Ryu, H. J., & Je, J. H. (1999). Effect of thin V insertion layer into Ta film on the performance of Ta diffusion barrier in Cu metallization. Journal of Applied Physics, 85(9), 6898.
Chicago
Kwak, Joon Seop, Hong Koo Baik, Jong-Hoon Kim, Sung-Man Lee, Hyuk Ju Ryu, and Jung Ho Je. 1999. “Effect of Thin V Insertion Layer into Ta Film on the Performance of Ta Diffusion Barrier in Cu Metallization.” Journal of Applied Physics 85 (9): 6898. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.54712308&authtype=sso&custid=ns315887.