A simplified modeling technique for finite element thermal analysis of a plastic SOIC package

Authors :: Mak, Tony W.C.
Feinstein, Leo G.
Source :: IEEE Transactions on Components and Packaging Technologies. March, 1999, Vol. 22 Issue 1, p6, 5 p.
Publication Year :: 1999
Abstract: A study presents an approximate, simple analytical method integrated with an ANSYS finite element program for thermal finite element evaluation of a surface mount, plastic, 23-L batwing SOIC package mounted on a multilayer personal computer board. The proposed method calls for modeling and analyzing both the package and board separately rather than generating a large package and board assembly finite element model for evaluation.

Subjects :: Electronic circuits -- Analysis
Integrated circuits -- Analysis
Thermal analysis -- Methods
Surface-mount technology -- Analysis
Business
Electronics and electrical industries
Engineering and manufacturing industries

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