Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging

MLA

Shin, Dong Kil, and Jung Ju Lee. “Effective Material Properties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic Packaging.” IEEE Transactions on Components, Packaging and Manufacturing Technology Part, vol. 21, no. 4, Nov. 1998, p. 413. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.53409682&authtype=sso&custid=ns315887.

APA

Shin, D. K., & Lee, J. J. (1998). Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology Part, 21(4), 413.

Chicago

Shin, Dong Kil, and Jung Ju Lee. 1998. “Effective Material Properties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic Packaging.” IEEE Transactions on Components, Packaging and Manufacturing Technology Part 21 (4): 413. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.53409682&authtype=sso&custid=ns315887.