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The LT1280 for Through-the-Pins Testing of the Thermal Conduction Module

Authors :
Pierson, R.L.
Williams, T.B.
Source :
IBM Journal of Research and Development. Jan, 1983, Vol. v27 Issue n1, pp35-40
Publication Year :
1983

Subjects

Subjects :
Quality Control
Computer Manufacture
Test Equipment
Logic Analyzer
Through-the-Pins Testing
Testing
LT1280

Details

ISSN :
00188646
Volume :
v27
Issue :
n1
Database :
Gale General OneFile
Journal :
IBM Journal of Research and Development
Publication Type :
Periodical
Accession number :
edsgcl.503966

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Authors Abstract Subjects Details