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A micromechanism study of thermosonic gold wire bonding on aluminum pad
- Source :
- Journal of Applied Physics. Dec 1, 2010, Vol. 108 Issue 11, 113517-1-113517-8
- Publication Year :
- 2010
-
Abstract
- A micromechanism of thermosonic gold wire bonding is described by analyzing its interfacial characteristics as a result of the bonding process, which has included the fragmentation of the native aluminum oxide layer on Al pads and formation of initial intermetallic compounds (IMCs). The formation mechanism of IMCs is described by using the effective heat of formation theory.
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 108
- Issue :
- 11
- Database :
- Gale General OneFile
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.248294399