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Multiseeded melt growth of bulk Y-Ba-Cu-O using thin film seeds

Authors :
Li, T.Y.
Wang, C.L.
Sun, L.J.
Yan, S.B.
Cheng, L.
Yao, X.
Xiong, J.
Tao, B.W.
Feng, J.Q.
Xu, X.Y.
Li, C.S.
Cardwell, D.A.
Source :
Journal of Applied Physics. July 15, 2010, Vol. 108 Issue 2, 023914-1-023914-6
Publication Year :
2010

Abstract

The article employs the different thin film sees to analyze the multiseeded melt growth of bulk Y-Ba-Cu-O compounds. An increase in the grain boundary contact angle is shown to lead to a significant decrease in the extent of residual melt deposited at the grain boundary.

Subjects

Subjects :
Barium compounds -- Electric properties
Barium compounds -- Mechanical properties
Copper oxide -- Electric properties
Copper oxide -- Mechanical properties
Grain boundaries -- Analysis
Yttrium -- Electric properties
Yttrium -- Mechanical properties
Physics

Details

Language :
English
ISSN :
00218979
Volume :
108
Issue :
2
Database :
Gale General OneFile
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
edsgcl.236119923

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