Quantitative interfacial energy measurements of adhesion-promoted thin copper films by supercritical fluid deposition on barrier layers

Subjects

Subjects :

Coating processes -- Analysis
Copper alloys -- Mechanical properties
Copper alloys -- Thermal properties
Tantalum -- Mechanical properties
Tantalum -- Thermal properties
Science and technology

Details

Language :

English

ISSN :

00944289

Volume :

132

Issue :

2

Database :

Gale General OneFile

Journal :

Journal of Engineering Materials and Technology

Publication Type :

Academic Journal

Accession number :

edsgcl.227729256