Optimization of finned heat sinks for impingement cooling of electronic packages

Subjects

Subjects :

Heat sinks (Electronics) -- Research
Electronic packaging -- Research
Circuit components -- Research
Electronics

Details

ISSN :

10437398

Volume :

120

Issue :

3

Database :

Gale General OneFile

Journal :

Journal of Electronic Packaging

Publication Type :

Academic Journal

Accession number :

edsgcl.21214417