Back to Search Start Over

On the positive temperature dependence of the thermal conductivity of a diamond-based heat sink paste

Authors :
Hasselman, D.P.H.
Donaldson, Kimmberly Y.
Source :
IEEE Transactions on Components, Packaging and Manufacturing Technology Part. March, 1998, Vol. 21 Issue 1, p124, 3 p.
Publication Year :
1998

Abstract

A study was conducted on the strongly positive temperature dependence of diamond-based heat sink paste thermal conductivity. The n-decane/diamond interface phononscattering was found to cause a finite interfacial thermal conductance that was highly positive temperature dependent. Results also show that the enhancement of diamond particle size will increase thermal conductivity and reduce dependence on positive temperature.

Details

ISSN :
10709886
Volume :
21
Issue :
1
Database :
Gale General OneFile
Journal :
IEEE Transactions on Components, Packaging and Manufacturing Technology Part
Publication Type :
Academic Journal
Accession number :
edsgcl.20803068