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Investigation of microstrip and coplanar transmission lines on lossy silicon substrates without backside metallization

Authors :
Durr, Woftgang
Erben, Uwe
Schippen, Andres
Dietrich, Harry
Schumacher, Hermann
Source :
IEEE Transactions on Microwave Theory and Techniques. May, 1998, Vol. 46 Issue 5, p712, 4 p.
Publication Year :
1998

Abstract

Silicon circuits, now penetrating well into the microwave frequency range, use lossy silicon substrates. Consequently, the microwave performance of transmission lines on this substrate becomes increasingly important and has been investigated here up to 20 GHz. It is shown that transmission lines on 20-[Omega] [center dot] cm substrates have no need for backside metallization and backside via holes. Two models for different line types are derived from measurements and verified against them. A coplanar waveguide (CPW) with an overall width of less than 30 [[micro]meter] was fabricated with an attenuation of 0.5 dB/mm at 20 GHz, which is acceptable for monolithic microwave integrated circuit (MMIC) design. Index Terms - Coplanar waveguides, microstrip, MMIC's, silicon, transmission lines.

Details

ISSN :
00189480
Volume :
46
Issue :
5
Database :
Gale General OneFile
Journal :
IEEE Transactions on Microwave Theory and Techniques
Publication Type :
Academic Journal
Accession number :
edsgcl.20794642