Materials and systems for two photon 3-D ROM devices

MLA

Dvornikov, Alexander S., et al. “Materials and Systems for Two Photon 3-D ROM Devices.” IEEE Transactions on Components, Packaging and Manufacturing Technology Part, vol. 20, no. 2, June 1997, p. 203. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.20090598&authtype=sso&custid=ns315887.

APA

Dvornikov, A. S., Cokgor, I., Wang, M., McCormick, F. B., Jr., Esener, S. C., & Rentzepis, P. M. (1997). Materials and systems for two photon 3-D ROM devices. IEEE Transactions on Components, Packaging and Manufacturing Technology Part, 20(2), 203.

Chicago

Dvornikov, Alexander S., Ilkan Cokgor, Mark Wang, Frederick B. McCormick Jr., Sadik C. Esener, and Peter M. Rentzepis. 1997. “Materials and Systems for Two Photon 3-D ROM Devices.” IEEE Transactions on Components, Packaging and Manufacturing Technology Part 20 (2): 203. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.20090598&authtype=sso&custid=ns315887.