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Foxconn and IBM to codevelop eco-friendly products
- Source :
- Printed Circuit Design & Fab. April, 2009, Vol. 26 Issue 4, p10, 1 p.
- Publication Year :
- 2009
-
Abstract
- Foxconn and IBM to Codevelop Eco-Friendly Products. Hon Hai (Foxconn) and IBM reportedly are set to sign a pact to codevelop environment-friendly products. The Central News Agency is reporting China [...]
Details
- Language :
- English
- ISSN :
- 15436527
- Volume :
- 26
- Issue :
- 4
- Database :
- Gale General OneFile
- Journal :
- Printed Circuit Design & Fab
- Publication Type :
- Periodical
- Accession number :
- edsgcl.198350586