Use of high-impedance surfaces in electromagnetic compatibility applications

This paper presents the results of an investigation into numerical simulation tools for high-impedance surfaces (HIS), with the primary aim of assisting in the design and optimization of these structures in electromagnetic compatibility (EMC) applications. The mathematically simple stub technique was used for capacitors and inductances to model lumped L and C in transmission line configurations. The basic principles of the transmission line modeling (TLM) method, such as the equivalences between the field quantities and circuit parameters, are briefly discussed and are applied on a uniform and a high-impedance transmission lines. Index Terms--EMC, high impedance surfaces (HIS), TLM.