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Long-range lateral dopant diffusion in tungsten silicide layers

Authors :
Liao, Shengzhou
Bain, Mike
Baine, Paul
McNeill, David W.
Armstrong, B. Mervyn
Gamble, Harold S.
Source :
IEEE Transactions on Semiconductor Manufacturing. Feb, 2009, Vol. 22 Issue 1, p80, 8 p.
Publication Year :
2009

Abstract

Novel diode test structures have been manufactured to characterize long-range dopant diffusion in tungsten silicide layers. A tungsten silicide to p-type silicon contact has been characterized as a Schottky barrier rectifying contact with a silicide work function of 4.8 eV. Long-range diffusion of boron for an anneal at 900[degrees]C for 30 min has been shown to alter this contact to become ohmic. Long-range diffusion of phosphorus with a similar anneal alters the contact to become a bipolar n-p diode. Bipolar diode action is demonstrated experimentally for anneal schedules of 30 min at 900[degrees]C, indicating long-range diffusion of phosphorus (~38/[micro]m). SIMS analysis shows dopant redistribution is adversely affected by segregation to the silicide/oxide interface. The concept of conduit diffusion has been demonstrated experimentally for application in advanced bipolar transistor technology. Index Terms--Diffusion processes, diodes, doping, tungsten compounds.

Details

Language :
English
ISSN :
08946507
Volume :
22
Issue :
1
Database :
Gale General OneFile
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
edsgcl.194332175