Wafer through-hole interconnections with high vertical wiring densities

A wafer through-hole interconnection method is suitable for electronic circuit fabrication. The method can provide high density three-dimensional (3-D) wiring systems with interconnections of high vertical wiring density. Electrodeposition of photoresist on 3-D micromachined substrates shows that the interconnection line width can be of the order of 20 micrometers. The vertical wiring density can be up to 250 cm(super -1).