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Rapid detailed temperature estimation for highly coupled IC interconnect

Authors :
Labun, Andrew
Jagjitkumar, Karan
Source :
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. Oct, 2008, Vol. 27 Issue 10, p1840, 12 p.
Publication Year :
2008

Details

Language :
English
ISSN :
02780070
Volume :
27
Issue :
10
Database :
Gale General OneFile
Journal :
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Publication Type :
Academic Journal
Accession number :
edsgcl.189585451