Analysis of a microchannel interconnect based on clustering of smart-pixel-device windows

A design analysis of a telecentric microchannel relay system developed for use with a smart-pixel-based photonic backplane is presented. The interconnect uses a clustered-window geometry in which optoelectronic device windows are grouped together about the axis of each microchannel. A Gaussian-beam propagation model is used to analyze the trade-off between window size, window density, transistor count per smart pixel, and lenslet f-number for three cases of window clustering. The results of this analysis show that, with this approach, a window density of 4000 windows/[cm.sup.2] is obtained for a window size of 30 [[micro]meter] and a device plane separation of 25 mm. In addition, an optical power model is developed to determine the nominal power requirements of a 32 x 32 smart-pixel array as a function of window size. The power requirements are obtained assuming a complementary metal-oxide semiconductor inverter-amplifier and dual-rail multiple-quantum-well self-electro-optic-effect devices as the receiver stage of the smart pixel.