Enhancement of a two-phase thermosyphon for cooling high heat flux power devices

Authors :: Kuwahara, Heikichi
Takahashi, Kenji
Nakajima, Tadakatsu
Takasaki, Toshio
Suzuki, Osamu
Source :: IEEE Transactions on Components, Packaging and Manufacturing Technology Part. Sept, 1995, Vol. 18 Issue 3, p596, 6 p.
Publication Year :: 1995
Abstract: A two-phase thermosyphon system was developed for cooling power devices having high heat fluxes, such as thyristas. The system utilizes an inert dielectric fluorocarbon as the heat-transfer medium, effecting heat transfer via boiling and condensation. The thermosyphon system demonstrated a maximum cooling capacity of 3 kW per power device.

Subjects :: Refrigeration equipment -- Models
Fluorocarbons -- Usage
Heat sinks (Electronics) -- Research
Electronics -- Heating, cooling and ventilation
Business
Engineering and manufacturing industries
Science and technology

ISSN :: 10709886
Volume :: 18
Issue :: 3
Database :: Gale General OneFile
Journal :: IEEE Transactions on Components, Packaging and Manufacturing Technology Part
Publication Type :: Academic Journal
Accession number :: edsgcl.18226637

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