A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints

MLA

Bhate, D., et al. “A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints.” Journal of Electronic Packaging, vol. 130, no. 2, June 2008, p. 21003. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.180591280&authtype=sso&custid=ns315887.

APA

Bhate, D., Chan, D., Subbarayan, G., & Nguyen, L. (2008). A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints. Journal of Electronic Packaging, 130(2), 21003.

Chicago

Bhate, D., D. Chan, G. Subbarayan, and L. Nguyen. 2008. “A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints.” Journal of Electronic Packaging 130 (2): 21003. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.180591280&authtype=sso&custid=ns315887.