A new method to determine crack shape and size in solder joints

Subjects

Subjects :

Solder and soldering -- Research
Surface-mount technology -- Research
Electronic packaging -- Research
Fracture mechanics -- Research
Welded joints -- Cracking
Electronics

Details

ISSN :

10437398

Volume :

117

Issue :

4

Database :

Gale General OneFile

Journal :

Journal of Electronic Packaging

Publication Type :

Academic Journal

Accession number :

edsgcl.17973349