Mechanical and electrical evaluation of a bumped-substrate die-level burn-in carrier

The mechanical and electrical performance of a temporary die-level burn-in carrier for obtaining known good die (KGD) were evaluated. The tests, which were carried out using a dynamic random access memory (RAM), a static RAM and an application-specific integrated circuit, found that the factors affecting the carrier's applicability were die size as well as bond pad count, size and pitch. The mechanical features tested included bump height, die alignment structure placement and bond pad damage.