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A wafer-scale 3-D circuit integration technology
- Source :
- IEEE Transactions on Electron Devices. Oct, 2006, Vol. 53 Issue 10, p2507, 11 p.
- Publication Year :
- 2006
-
Abstract
- The rationale and development of a wafer-scale three-dimensional (3-D) integrated circuit technology are described. The three-dimensional intergration process is described as well as the properties of the four enabling technologies.
- Subjects :
- Circuit design -- Analysis
Three-dimensional display systems -- Usage
Semiconductor wafers -- Design and construction
Integrated circuit fabrication -- Methods
Integrated circuit fabrication -- Technology application
Circuit designer
Integrated circuit design
3D technology
Integrated circuit fabrication
Technology application
Business
Electronics
Electronics and electrical industries
Subjects
Details
- Language :
- English
- ISSN :
- 00189383
- Volume :
- 53
- Issue :
- 10
- Database :
- Gale General OneFile
- Journal :
- IEEE Transactions on Electron Devices
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.153940721