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Adopting CMP processes to achieve new materials integration

Authors :
Rhoades, Robert L.
Murphy, Jim
Source :
Micro. July, 2006, Vol. 24 Issue 6, p51, 4 p.
Publication Year :
2006

Subjects

Subjects :
Grinding and polishing -- Methods
Semiconductor preparation -- Methods
Complementary metal oxide semiconductors -- Design and construction

Details

Language :
English
ISSN :
10810595
Volume :
24
Issue :
6
Database :
Gale General OneFile
Journal :
Micro
Publication Type :
Periodical
Accession number :
edsgcl.149874752

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