Meeting reliability requirements for 300-nm CMP manufacturing using integrated metrology

Subjects

Subjects :

Standard IC
Semiconductor industry
Integrated circuits -- Production processes
Semiconductor chips -- Production processes
Semiconductor industry -- Production processes
Electronic measurements -- Usage
Grinding and polishing -- Methods
Semiconductor preparation -- Methods

Details

Language :

English

ISSN :

10810595

Volume :

24

Issue :

6

Database :

Gale General OneFile

Journal :

Micro

Publication Type :

Periodical

Accession number :

edsgcl.149874727