Packaging alternatives for high lead count, fine pitch, surface mount technology

Pitch surface mount technology (SMT) is used to design extremely compact, low cost components used for highly density, high lead content integrated circuits (IC's), which are mainly used in the design and manufacture of portable electronic items. Packaging formats for high lead count IC's include the direct chip attachment, tape carrier package (TCP), molded TCP and Quad flat pack (QFP) formats of optimization of these SMT component packing formats depends on the user's ability.