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Packaging conference high on chip-on-board

Authors :
Costlow, Terry
Source :
Electronic Engineering Times. Sept 6, 1993, Issue n762, p1, 2 p.
Publication Year :
1993

Subjects

Subjects :
Microelectronics
Semiconductor Preparation
Conferences and Meetings
Packaging Density
Semiconductor Industry
Semiconductor Device

Details

ISSN :
01921541
Issue :
n762
Database :
Gale General OneFile
Journal :
Electronic Engineering Times
Publication Type :
Periodical
Accession number :
edsgcl.14393512

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Authors Abstract Subjects Details