Smoothing of the Si surface using CF4/O2 down-flow etching

MLA

Nishino, H., et al. “Smoothing of the Si Surface Using CF4/O2 down-Flow Etching.” Journal of Applied Physics, vol. 74, no. 2, July 1993, p. 1349. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.14239790&authtype=sso&custid=ns315887.

APA

Nishino, H., Hayasaka, N., Horioka, K., Shiozawa, J., Nadahara, S., Shooda, N., Akama, Y., Sakai, A., & Okano, H. (1993). Smoothing of the Si surface using CF4/O2 down-flow etching. Journal of Applied Physics, 74(2), 1349.

Chicago

Nishino, H., N. Hayasaka, K. Horioka, J. Shiozawa, S. Nadahara, N. Shooda, Y. Akama, A. Sakai, and H. Okano. 1993. “Smoothing of the Si Surface Using CF4/O2 down-Flow Etching.” Journal of Applied Physics 74 (2): 1349. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.14239790&authtype=sso&custid=ns315887.