A study of residual stress distribution through the thickness of p+ silicon films

MLA

Wen-Hwa, Chu, and Mehran Mehregany. “A Study of Residual Stress Distribution through the Thickness of P+ Silicon Films.” IEEE Transactions on Electron Devices, vol. 40, no. 7, July 1993, p. 1245. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.14169333&authtype=sso&custid=ns315887.

APA

Wen-Hwa, C., & Mehregany, M. (1993). A study of residual stress distribution through the thickness of p+ silicon films. IEEE Transactions on Electron Devices, 40(7), 1245.

Chicago

Wen-Hwa, Chu, and Mehran Mehregany. 1993. “A Study of Residual Stress Distribution through the Thickness of P+ Silicon Films.” IEEE Transactions on Electron Devices 40 (7): 1245. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.14169333&authtype=sso&custid=ns315887.