A study of thermal stress and intrinsic residual stress in planar metallization for integrated power modules

In integrated power modules, mechanical properties of interfaces between deposited copper traces and substrates are important for reliable operation. This paper investigates the values of thermomechanical stresses by IDEAS simulation and describes an experimental method to calculate intrinsic residual stresses using the Stoney equation based on the bending curvature of the sample. Index Terms--Intrinsic residual stress, planar metallization, thermomechanical stress.