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Wire bonding strategies to meet thin packaging requirements

Authors :
Levine, Lee
Sheaffer, Michael
Source :
Solid State Technology. March, 1993, Vol. 36 Issue 3, p63, 5 p.
Publication Year :
1993

Abstract

The introduction of thin small outline packages (TSOP) and thin quad flat packages (TQFP) has resulted in a new era of semiconductor assembly development |1~. New wirebonders and control software […]

Subjects

Subjects :
Integrated circuit fabrication
Packaging density (Electronics) -- Research
Integrated circuit fabrication -- Research

Details

Language :
English
ISSN :
0038111X
Volume :
36
Issue :
3
Database :
Gale General OneFile
Journal :
Solid State Technology
Publication Type :
Periodical
Accession number :
edsgcl.13885980

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